宋长发编著的《电子组装技术专业英语》介绍了电子组装的材料、设备、工艺、管理等方面的内容，考虑到生产实际情况，对生产过程中的一些问题及其解决方法用表格的形式进行描述。学生通过学习本教材，更贴近生产实际，为将来学生零距离上岗奠定基础。

《电子组装技术专业英语》对所选内容进行了仔细分析，将其中的生字词专门列于课文后面方便学生查阅学习，对课文中的难句进行了分析，旨在帮助学习者尽快掌握最基本的知识。本教材的另一个特点是对课文中最基础的内容给出了译文，读者通过英汉对照也能在最快的时间了解电子组装的工艺过程和英文表达方式。

宋长发编著的《电子组装技术专业英语》按照生产企业电子组装工艺流程介绍了组装元器件、印制电路板、助焊剂、胶黏剂、焊料、清洗剂等材料的基本知识，介绍了电子组装生产线的组成、贴片机的基本结构和作用。简要介绍了焊接技术、清洗技术、检测技术等电子组装各工艺环节的工艺方法，生产过程中的静电防护技术等内容。

《电子组装技术专业英语》适合作为应用型、技能型人才培养的大专院校(高职高专)应用电子类专业教材，也可作为电子组装专业技术培训用书，供从事电子组装工程技术人员参考。

Unit One

1.1 Printed circuit assembly

1.2 Assembly techniques

1.3 SMT design and assembly

1.4 PCB assembly flows

Unit Two SMC and SMD

2.1 Surface mount device definitions

2.2 Sizes of surface mount device

2.3 SMD chip resistors

2.4 SMD ceramic capacitors

2.5 SMD Tantalum capacitors

2.6 SMD MELF

2.7 SMD transistors

2.8 Mounting of Surface Mount component

2.9 Component size comparison

Unit Three Printed circuit boards

3.1 The types of printed circuit board

3.2 PCB design

3.3 PCBs Raw Materials

3.4 Drilling and plating the holes of printed circuit

boards

3.5 Creating the printed circuit pattern on the substrate

3.6 Attaching the contact fingers

Unit Four Adhesives

Unit Five Types of solder paste fluxes

5.1 Flux and its requirement

5.2 Inorganic acid fluxes

5.3 Organic acid fluxes

5.4 Rosin

5.5 No-clean fluxes

Unit Six Solder alloys and applications

6.1 Introduction

6.2 Availability and type of solders

Unit Seven Surface Mounted Technology

7.1 Component Placement Machines

7.2 Surface Mounted Technology

7.3 Component pick-up head types

Unit Eight Techniques of solder interconnection

8.1 Soldering iron method

8.2 Hot air reflow soldering method

8.3 Laser reflow soldering method

8.4 Pulse heating method

8.5 IR method

8.6 Vapor phase soldering (VPS)method

8.7 Convection reflow method(air or N2 reflow)

8.8 Combined convection IR method

8.9 Flow/wave soldering method

8.10 The temperature profile concept

8.11 Pb-free soldering process

Unit Nine Cleaning

9.1 Water-soluble fluxes

9.2 No-clean fluxes

9.3 Pcb assembly cleaning

9.4 Pcb cleaning test

Unit Ten SMA inspection technique

10. 1 Vision system of component placement machines

10. 2 Inspection process

10.3 Visual inspection equipment

10.4 Visual inspection items

Unit Eleven Handling and ESD control

11.1 Electrostatic discharge

11.2 ESD and EOS

11.3 Requirements of static-free work station

附录A CP-6系列富士贴片机操作简介

A1.1 Machine components and operation panel

A1.2 Starting and Stopping the Machine

附录B 专业词汇

References