集成电路封装材料表征一书讨论了含有IC封装的材料系统。布伦德尔、埃文斯、摩尔编著的《集成电路封装材料的表征》中的各章强调了IC封装的重要特性。通过对关键性能参数进行测试的实例及对IC封装关键技术问题的分析，它展示了分析技术对于IC封装表征是适用的。这本书讨论了影响各种封装类型的问题，包括：塑料表面贴装、气密封装与先进设计如反装晶片、板上芯片与多片模型。

Foreword

Preface to the Reissue of the Materials Characterization Series

Preface to Series xiv

Preface to the Reissue of Integrated Circuit Packaging Materials

Preface

Contributors

IC PACKAGE RELIABILITY TESTING

  1.1 Introduction 

  1.2 In-Process Quality Measurements 

   Wire Bond Quality 3, Die Attach Quality 4, Other Process Control Measurements 8

  1.3 Package-Oriented Reliability Testing of Finished Devices: Moisture Testing 

   Failure Analysis of Moisture-Related Failures 11, Root Causes of Corrosion Failures 

  1.4 Package-Oriented Reliability Testing of Finished Devices: Thermal Cycle Testing 

   Bond Failures: Bond Pad Contamination 16, Intermetallic Formation

   and Other Elements of Bond Formation 

  1.5 Reliability Test Preconditioning: A New Direction 

  1.6 Summary 

MOLD COMPOUND ADHESION AND STRENGTH

MECHANICAL STRESS IN IC PACKAGES

MOISTURE SENSITIVITY AND DELAMINATION

THERMAL MANAGEMENT

ELECTRICAL PERFORMANCE OF IC PACKAGES

SOLDERABILITY OF INTEGRATED CIRCUITS

HERMETICITY AND JOINING IN CERAMIC IC PACKAGES

ADVANCED INTERCONNECT TECHNOLOGY

APPENDIX: TECHNIQUE SUMMARIES